Turn and Mass Production Capabilities for PCB assemblies

Quick Turn and Mass Production Capabilities for PCB assemblies and system assemblies

  • Surface Mount Processes (SMT)
  • Smallest surface mount component: 01005
  • BGA / QFN Pitch 0.3mm.
  • Maximum PCBA size 750x610mm
  • BGA (PoP) process
  • Vapor phase soldering and low void soldering
  • Wave soldering and selective wave soldering
  • Precision press fit process
  • Glue dispensing and conformal coating
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